技術服務

Design services

來源: 發布時間:2016-4-15 16:21:48 瀏覽次數:0

   

HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.

    Package Design Team services include:

?  Customer-centric design.

?  High quality, reliable, and cost effective packaging proposal.

?  DFM (Design For Manufacturing) and DFC (Design for Cost).

?  Supporting auto- check of design and Drawings.

Design Capabilities:

   Multi-Chip ModulesMCM

   System-in-Package (SiP)

   Flip Chip Package

   Hybrid Package

   Package-in-Package (PiP)

   Package-on-Package (PoP)

   Embedded Package

分享到:

上一篇: Simulation services
下一篇:沒有資料

宝马棋牌
6场半全场全包盈利 股票分析师报考条件 熊猫麻将血战到底 十一选五陕西走势图 今天沪市股票指数 3d开机号今天查询 爱联助学基金理财平台 北京快中彩app 涨鑫宝配资 大快乐透开奖 股票行情日线图中如何分析支撑线和阻力线 j江苏快三一定牛 易配资 快3走势图湖北 股票分析师群 江苏快三走势图一定牛